Create electronic and electrical products faster and with maximum resource savings.

Ansys electronic solutions help you design innovative and efficient electrical and electronic products. The electromagnetic, circuitry, systems and multidisciplinary field system fully automates the development process so you can better understand how your products behave. You can quickly optimize your project using simulation rather than waste time creating and testing costly prototypes. Whether it's a computer chip, a circuit board, a cell phone, an electronic component in a car or an entire communication system, Ansys solutions help you create the best products.

Wireless and RF

Ansys high-frequency electromagnetism design software allows designing, simulating and validating the performance of RF and microwave antennas and components. The microwave integrated circuit and modeling capabilities of the system are directly integrated with our electromagneticsolvers, which provide a platform for the verification of the complete system of state-of-the-art RF and microwave designs.

PCB and electronic encapsulation

The design flow of the Ansys Chip-Package-System (CPS) offers unparalleled simulation capability and speed for power, signal integrity and EMI analysis of high-speed electronic devices. Automated thermal analysis and integrated structural analysis capabilities complete the industry's most comprehensive simulation solution in the chip-encapsulation-plate system.

Electromechanical and power

Ansys electronic simulation software is ideal for applications that depend on the robust integration of motors, sensors and actuators with electronic controls. In it, it is possible to simulate interactions between these components and the design flow to incorporate thermal and mechanical analysis to evaluate cooling strategies and analyze critical mechanical effects such as noise vibration (NVH).

Electronic thermal management

Ansys' electronic thermal management solutions leverage advanced solution technology with robust automatic mesh to enable rapid heat transfer and simulation of fluid flows for cooling strategies, helping design cooling strategies to avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centers, power electronics and electric motors.